SUSS MicroTec SE (MDAX/TecDAX: SMHN) has announced its entry into the wafer-level cleaning market with the launch of the GreenTec Solutions product line and the introduction of its first system, the GT200. This strategic move expands SUSS' technology portfolio into a market valued at approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and increasing semiconductor demand from AI and high-performance computing applications.
The GreenTec Solutions line addresses the semiconductor industry's growing need for sustainable manufacturing processes. By combining proven SUSS technologies—TurbulenStrip™ and CrustBuster™—in a single hybrid platform, the GT200 enables efficient resist and residue removal while significantly reducing chemical consumption and eliminating hazardous acids and organic solvents. This approach not only supports customers' environmental, social, and governance (ESG) goals but also lowers overall cost-of-ownership, making it a competitive differentiator in the market.
"GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy," said Burkhardt Frick, CEO of SUSS. "By expanding into wafer-level cleaning, we are entering an attractive market with significant long-term growth potential while leveraging proven technologies and process expertise from our existing portfolio."
The GT200 is specifically designed for research and development, process qualification, and production in 200 mm manufacturing environments for MEMS, RF, power device, and CMOS applications. SUSS supports customers through joint evaluation programs, process co-development, and recipe optimization services to accelerate adoption and de-risk technology transfers. For more information about the GT200, visit https://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200.
The launch of GreenTec Solutions positions SUSS to capitalize on the growing demand for advanced semiconductor manufacturing equipment. The wafer-cleaning market is essential for ensuring yield and reliability in chip production, and SUSS' entry with a sustainable solution aligns with industry trends toward greener processes. The GT200's hybrid concept consolidates multiple cleaning and stripping steps, reducing wafer transfers and toolset complexity, which can lead to shorter process learning cycles and improved operational efficiency.
Following a clear roadmap, SUSS plans to expand the GreenTec platform toward high-volume manufacturing (HVM) with a dedicated 300 mm HVM platform in 2027, followed by a 200 mm HVM platform in 2028. "Due to the strong interest from our customers, we are pulling in the launch of a 300 mm HVM solution," said Yuta Nagai, Senior Vice President Photomask Solutions at SUSS. This provides customers with a clear migration path from evaluation to full-scale production. SUSS will showcase the latest developments in wafer-level cleaning at SEMICON West; registration details are available at https://www.suss.com/en/company/events/semicon-west.
This announcement underscores SUSS' commitment to innovation and sustainability in semiconductor manufacturing. By leveraging its expertise in photomask processing and transferring it to wafer-level cleaning, SUSS is well-positioned to meet the evolving needs of the industry. The company's focus on eco-friendly solutions and modular platforms aligns with the broader industry shift toward responsible resource use and advanced packaging technologies. For more information about SUSS, visit www.suss.com.
